Elite High Density SFP Cage Connector 2X2 Combo S1N3B23000CA4 Replacement of UE78-B2127-00321

Product Overview

As part of Vitalconn’s comprehensive interconnect portfolio, the S1N3B23000CA4 is a market-proven solution designed for entry-level network access layers and edge devices. This 2×2 stacked (vertical) combo assembly is purpose-built to allow cloud providers and server OEMs to use compact designs while maintaining high port density. It integrates high-precision materials, including a nickel-plated copper alloy cage and high-temperature LCP connector housing, to deliver reliability in demanding environments.

Product Specifications

• Part Number: S1N3B23000CA4.
• Configuration: 2×2 Combo with Grounding Pins (Stacked/Vertical).
• Speed Spectrum: Optimized for SFP (1.25G/2.5G) standards.
• Material: Nickel-plated Copper Alloy cage (0.25mm), High-temperature LCP plastic (UL94 V-0), and Phosphor Bronze contacts.
• Plating: 30μ” minimum Gold in the mating area and 150μ” minimum Matte Tin on solder tails.
• Operating Temperature: -40°C to +85°C.
• Manufacturing Precision: General tolerances up to .XXX ±0.10.

Product Features

• Superior EMI Shielding: Incorporates high-performance multi-point grounding springs and a precision shielding finger design to provide a 360-degree full-circumference low-impedance electrical connection, effectively isolating interference and ensuring zero packet loss.
• Advanced Thermal Management: Features an open-frame structure that acts as a “dedicated air conditioner” for transceivers, measured to reduce core temperatures by 5-8°C through enhanced air convection.
• High Reliability: Validated through rigorous electrical and mechanical testing, including mating cycle life, vibration, and thermal shock tests in industry-leading labs.
• Standards Support: Fully supports Hot-Plug capabilities and Digital Diagnostic Monitoring (DDM/DOM) to ensure business continuity and easy system maintenance.

Applications

• Data Centers: High-density server access and enterprise core network infrastructure.
• 5G Communications: Stable physical-layer connections for base station AAU/DU units and edge computing nodes.
• AI Infrastructure: Reliable data exchange for intelligent computing centers and AI supercomputing clusters.
• Industrial Automation: Signal transmission systems for security surveillance and industrial control networks.

Packing Details

Components are packaged using a tray system designed for maximum protection.

• Quantity: 18 products per tray; 5 trays per box (Total 90 pieces per box).
• Orientation: Adjacent trays are rotated 180 degrees horizontally relative to each other to ensure component safety and space efficiency.
• Box Dimensions: L340 x W265 x H200mm.

FAQ

Q1: How does the 2×2 combo design with grounding pins improve system performance? A: The 2×2 stacked configuration doubles the vertical port density in a compact footprint, allowing for more efficient use of PCB space. The dedicated grounding pins ensure a zero-potential reference and 360-degree electrical connection, which is critical for eliminating contact resistance and suppressing EMI.

Q2: Can this SFP cage handle the heat generated by modern high-speed transceivers? A: Yes. The S1N3B23000CA4 features an advanced open-frame structure and a precision top-punch array. This design has been measured to reduce transceiver core temperatures by 5-8°C, ensuring that your equipment operates stably even during massive data throughput.

Q3: Is this product suitable for use in harsh, unattended environments? A: Absolutely. Vitalconn’s SFP series is engineered for high reliability and has undergone extensive environmental adaptability testing, including temperature/humidity cycling and salt fog tests. This makes it an ideal choice for outdoor 5G base stations and industrial automation equipment.

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