High Performance SFP+ 1×1 Cage with Heat Sink Press Fit S2N3122055NA4

The S2N3122055NA4 is a high performance SFP+ 1×1 Cage with heat sink and press fit termination, designed for reliable signal integrity and thermal management in high-speed data communication systems. This SFP+ 1×1 Cage with heat sink features a copper alloy construction with nickel plating, ensuring excellent EMI shielding and durability. The SFP+ 1×1 Cage with heat sink supports a wide operating temperature range and is RoHS compliant.

Cage Connector Type	СФП+
Heat Sink	Yes
Light Pipe	No
Number of Ports	1*1
Terminal Tail	Press-Fit

S2N3122055NA4-SFP Plus 1×1 Cage with heatsink

Product Overview

The S2N3122055NA4 is a 1×1 SFP+ cage assembly with an integrated heat sink and press fit terminals, designed for high-speed data transmission applications. It features a copper alloy cage construction with nickel plating, and the heat sink provides enhanced thermal dissipation for high-power transceiver modules. The product supports an operating temperature range of -40°C to +85°C and is packaged in trays for safe handling and automated assembly.

Product Specifications

· Product Number: S2N3122055NA4
· Cage Type: SFP+
· Port Count: 1×1 (1 port)
· Terminal Tail: Press Fit
· Heat Sink: Yes (Integrated)
· Cage Material: Copper Alloy, Nickel Plated
· Operating Temperature: -40°C to +85°C
· Storage Temperature: -55°C to +105°C
· Packaging: Tray Packaging
· RoHS Compliant: Yes

Product Features

· High performance SFP+ 1×1 cage with heat sink for superior thermal management
· Press fit termination for secure and solderless PCB mounting
· Copper alloy cage with nickel plating for excellent EMI shielding and durability
· Integrated heat sink ensures reliable operation of high-speed transceivers
· Wide operating temperature range suitable for industrial environments
· Tray packaging for efficient handling and automated assembly
· RoHS compliant, meeting environmental standards

Applications

· Data center switches and routers
· High-speed networking equipment
· Telecommunications infrastructure
· Enterprise server and storage systems
· 10G/25G fiber optic transceiver modules requiring thermal management

Packing Details

· Each tray holds 18 products
· Each box contains 90 products (5 trays)
· Trays are stacked with a 180-degree rotation between layers
· Packaging includes tray base, tray cover, label, and packaging tapes for securing

FAQ

Q1: What is the terminal type of the S2N3122055NA4?
A1: The S2N3122055NA4 features a press fit terminal type, designed for solderless press-fit mounting to the PCB.

Q2: Does the S2N3122055NA4 include a heat sink?
A2: Yes, the S2N3122055NA4 comes with an integrated heat sink for enhanced thermal management of high-power transceiver modules.

Q3: How is the S2N3122055NA4 packaged for shipping?
A3: It is packaged in trays, with 18 products per tray and 90 products per box (5 trays per box). Trays are stacked with a 180-degree rotation between layers.

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