Elite 10G 25G SFP+ 2X1 Cage Connector Stacked S2N3A23004BA4

Product Overview

As a core component of Vitalconn’s market-proven SFP+ series, the S2N3A23004BA4 is designed to empower AI computing, 5G infrastructure, and cloud-network convergence. This 2×1 stacked assembly serves as the perfect successor to the 10G era, achieving a bandwidth leap to 25G without increasing physical footprint. It provides a flexible, evolution-ready architectural foundation that is natively backward compatible with standard SFP modules to protect existing infrastructure investments.

Product Specifications

• Part Number: S2N3A23004BA4.
• Configuration: 2×1 Stacked (Vertical) ports.
• Interface Type: Integrated SFP+ Cage and Connector.
• Speed Spectrum: Optimized for 10Gbps to 25Gbps per-channel performance.
• Manufacturing Precision: High-precision engineering with linear tolerances reaching .XXX±0.10.
• Reliability Standards: Validated through vibration, thermal shock, and mating cycle life testing.

Product Features

• Superior EMI Shielding: Utilizes high-performance grounding springs to achieve a 360-degree full-circumference low-impedance electrical connection, effectively isolating external interference and establishing a zero-potential reference.
• Advanced Thermal Management: Features an open-frame structure with a precision top-punch array that acts as a “dedicated air conditioner,” measured to reduce transceiver operating core temperatures by 5-8°C.
• Zero-Packet-Loss Signal Integrity: Simulation-optimized internal structures strictly control electromagnetic crosstalk between ports to ensure stable high-speed data transmission.
• Intelligent Monitoring Support: Fully supports hot-plug capabilities and Digital Diagnostic Monitoring (DDM/DOM) to ensure business continuity and simplified maintenance.

Applications

• Data Centers: The undisputed mainstream choice for high-density server access and ToR (Top-of-Rack) switch interconnects.
• 5G Communications: Stable physical-layer connections for base station AAU/DU units and edge computing nodes.
• AI Infrastructure: Massive data throughput support for AI supercomputing clusters and real-time inference engines.
• Enterprise Networks: Reliable infrastructure for virtualization, databases, and mission-critical network modernization.

Packing Details

Following Vitalconn’s standard high-protection protocols, these components are typically packaged in blister trays. To ensure maximum component safety and shipping efficiency during transport, adjacent components or trays within the packaging are placed at a 180-degree horizontal orientation relative to each other.

FAQ

Q1: How does the 2×1 stacked design facilitate network upgrades? A: The 2×1 stacked configuration allows manufacturers to double the vertical port count in a single footprint compared to individual cages. This enables a smooth bandwidth jump (e.g., from 10G to 25G) with virtually no increase in physical size, allowing for denser and more efficient rack designs.

Q2: Can the S2N3A23004BA4 handle the heat from continuous high-speed data bursts? A: Yes. The cage utilizes a precision open-frame top-punch array that maximizes natural air convection. This passive cooling system has been measured to lower core transceiver temperatures by 5-8°C, preventing thermal-induced performance drops and extending component life.

Q3: How does the product ensure zero packet loss in interference-heavy environments? A: It employs a multi-layer EMI protection system, including multi-point beryllium copper grounding springs and precision shielding fingers. This design achieves a 360-degree low-impedance connection that suppresses signal crosstalk to extremely low levels (<-40dB@10GHz).

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