SFP+ 1X1 Connector Elite 10G 25G Single Port S2C2100D00BA4

The S2C2100D00BA4 is an Elite high-performance SFP+ 1X1 Connector designed to serve as the physical foundation for next-generation 10G and 25G network architectures. This precision-engineered SFP+ 1X1 Connector provides a stable 10Gbps to 25Gbps per-channel rate, utilizing advanced EMI shielding and an open-frame structure to ensure zero-packet-loss signal integrity in demanding data center and 5G environments.

Mounting Type	SMD
Cage Connector Type	SFP, SFP+

S2C2100D00BA4

Product Overview

As a market-proven classic in the SFP+ portfolio, the S2C2100D00BA4 balances high-speed performance with maximum device compatibility. This 1×1 single-port assembly is the undisputed mainstream choice for server access and ToR (Top-of-Rack) switch interconnects. It provides a flexible, evolution-ready architectural foundation that allows for a smooth speed jump from 10G to 25G without increasing physical size or power consumption.

Product Specifications

Part Number: S2C2100D00BA4.
Configuration: 1X1 Single Port.
Data Rate Support: Optimized for 10Gbps (SFP+) and 25Gbps (SFP28) speed spectrums.
Manufacturing Precision: High-precision engineering with linear tolerances reaching as tight as .XXX±0.10.
Angular Tolerance: Precision controlled at .XX°±5°.
Standard Compliance: Fully supports Hot-Plug capabilities and Digital Diagnostic Monitoring (DDM/DOM).

Product Features

Superior EMI Shielding: Employs high-performance beryllium copper grounding springs for a 360-degree full-circumference low-impedance electrical connection, effectively isolating external interference and ensuring zero packet loss.
Advanced Thermal Management: Features an “open-frame” structure that acts as a dedicated air conditioner for transceivers, measured to reduce operating core temperatures by 5-8°C through enhanced natural air convection.
Low-Latency Integrity: Strictly controls electromagnetic crosstalk between ports (<-40dB@10GHz) to support microsecond-level data exchange for mission-critical systems.
High Reliability: Validated through rigorous reliability testing, including vibration, thermal shock, and mating cycle tests in integrated laboratories.

Applications

Data Centers: The mainstream choice for high-density server access and core-layer switch interconnects.
5G Communications: Stable physical-layer connections for base station AAU/DU units and edge computing nodes in harsh outdoor environments.
AI Infrastructure: Reliable data throughput support for AI supercomputing clusters and real-time inference engines.
Enterprise Networks: Proven stability for virtualization, databases, and mission-critical network modernization.

Packing Details

Following standard high-protection protocols, these components are typically packaged in blister trays. To ensure maximum component safety and shipping efficiency, adjacent components or trays within the packaging are placed at a 180-degree horizontal orientation relative to each other.

FAQ

Q1: How does the S2C2100D00BA4 facilitate network upgrades from 10G to 25G? A: This connector serves as a “future-ready” investment by maintaining backward compatibility with 10G SFP+ modules while natively supporting 25G speeds. This allows operators to double their bandwidth with virtually no increase in physical footprint, enabling a smooth migration path.

Q2: Can this connector prevent performance throttling in high-speed optical modules? A: Yes. The “open-frame” design maximizes natural air convection, which has been measured to lower the core temperature of transceivers by 5-8°C. This prevents thermal-induced performance drops, ensuring stability even during continuous high-speed data bursts.

Q3: How does the product ensure signal stability in interference-heavy environments? A: It utilizes a professional multi-layer EMI protection system, including multi-point beryllium copper grounding springs that establish a 360-degree connection. This design eliminates contact resistance and isolates external interference to achieve zero packet loss.