Durable 1.85mm Height SMT TF Card Connector Inner Solder VTC102014462

The VTC102014462 is a high-performance TF Card Connector designed for compact electronic devices that require reliable external storage. Featuring an ultra-low profile height of 1.85mm and a space-saving inner-solder mounting style, it ensures secure card engagement and excellent electrical performance. Built with a durable stainless steel shell and precision C5210 terminals, this connector is optimized for long-term stability in high-density mobile and portable designs.

Card Detect Switch	Yes
Card Holder No. of positions	9
Card Holder Type	Micro SD
Card Removal Method	Push in/Auto eject out

VTC102014462 1.85H P_P TF Card常闭一体式内焊

Product Overview

This product is a surface-mount technology (SMT) TF (Micro SD) card socket characterized by its 1.85mm height and “inner solder” lead configuration. The inner-solder design is specifically engineered to reduce the PCB footprint, making it an ideal choice for slim devices where space around the component is limited. It utilizes a push-push mechanism for user-friendly card insertion and removal.

Product Specifications

Part Number: VTC102014462
Card Type: TF (Micro SD) Card
Mechanism: Push-Push
Profile Height: 1.85 mm
Mounting Style: SMT (Inner Solder )
Housing Material: LCP (Liquid Crystal Polymer), Black
Terminal Material: C5210 Copper Alloy
Shell Material: Stainless Steel
Environmental Compliance: RoHS Compliant
Standard Tolerances: .X ± 0.30mm, .XX ± 0.20mm, .XXX ± 0.10mm

Product Features

Compact Inner Solder Design: The inner solder configuration allows for a smaller overall PCB area, facilitating high-density layouts.
Ultra-Low Profile: A mounting height of only 1.85mm is ideal for the latest generation of thin mobile electronics.
High-Grade Materials: Utilizes C5210 terminals for superior elasticity and fatigue resistance compared to standard alloys.
Robust Construction: The stainless steel outer shell provides excellent mechanical strength and shielding for the internal components.
Thermal Stability: The black LCP housing is specifically selected to withstand the heat of automated reflow soldering processes.

Applications

Slim Smartphones and Tablets
Wearable Devices (Smartwatches, Fitness Trackers)
Compact IoT Modules and Sensors
Portable Medical Monitoring Tools
Action Cameras and Drones

Packing Details

(Note: As per standard industry practice for these SMT components from Vitalconn):

Packaging Type: Tape and Reel (Carrier Tape)
Assembly Compatibility: Fully optimized for high-speed automated pick-and-place SMT production lines.

FAQ

1. What is the specific height of the VTC102014462 connector? The connector features an ultra-low profile height of 1.85mm, making it suitable for very thin electronic device designs.

2. What is the benefit of the “Inner Solder” design? The “Inner Solder” design allows the solder leads to be tucked under or within the connector’s footprint, which saves valuable surface space on the PCB.

3. What materials are used for the housing and terminals? This model is constructed with a black LCP (Liquid Crystal Polymer) housing and high-quality C5210 copper alloy terminals for enhanced durability.