Elite High Speed SFP+ Cage Connector 2X2 Stacked S2N3B23004BA4

The S2N3B23004BA4 is an Elite high-performance SFP Plus Cage Connector engineered to serve as a robust physical foundation for modern network infrastructure. This integrated SFP Plus Cage Connector features a 2×2 stacked configuration that balances 10G to 25G performance with extreme device compatibility, ensuring stable signal transmission through advanced EMI shielding and superior thermal management.

Heat Sink	No
Cage Connector Type	SFP+
Light Pipe	Yes
Number of Ports	2*2
Terminal Tail	Press-Fit

S2N3B23004BA4

Product Overview

As a core component of Vitalconn’s high-speed portfolio, the S2N3B23004BA4 is a market-proven solution designed for enterprise core network upgrades and storage networks. This 4-port stacked assembly allows server OEMs to use compact server designs while doubling vertical port density. It provides a flexible, evolution-ready architectural foundation that is natively backward compatible with standard SFP modules to protect existing infrastructure investments.

Product Specifications

Part Number: S2N3B23004BA4.
Port Configuration: 2×2 Stacked (4 ports total).
Data Rate Support: Optimized for 10Gbps to 25Gbps per-channel speed spectrums.
Manufacturing Precision: Features high-precision engineering with general tolerances reaching as tight as .XXX±0.10.
Mechanical Integrity: Validated through mating cycle life, vibration, and thermal shock testing.
Mounting Technology: Optimized for Press-Fit high-reliability mechanical interlocking.

Product Features

Superior EMI Shielding: Utilizes high-performance beryllium copper grounding springs for a 360-degree full-circumference low-impedance connection and precision shielding fingers to block high-frequency radiation, ensuring zero packet loss.
Advanced Thermal Management: Features an open-frame structure with a precision top-punch array that acts as a “dedicated air conditioner,” measured to reduce transceiver core temperatures by 5-8°C through enhanced natural air convection.
Press-Fit High Reliability: Employs mechanical interlocking that fundamentally eliminates solder joint failure risks, offering a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering.
Intelligent Monitoring: Fully supports hot-plug capabilities and Digital Diagnostic Monitoring (DDM/DOM) for real-time status tracking and simplified maintenance.

Applications

Data Centers: High-density server access and Top-of-Rack (ToR) switch interconnects.
5G Communications: Stable physical-layer connections for base station AAU/DU units and edge nodes in harsh outdoor environments.
AI Infrastructure: Massive data throughput support for intelligent computing centers and AI training clusters.
Industrial & Telecom: Reliable connectivity for industrial automation, rail transit signal systems, and aerospace electronic equipment.

Packing Details

Following standard high-protection protocols, these components are packaged in protective trays. To ensure maximum component safety and shipping efficiency, adjacent components within the tray are placed at a 180-degree horizontal orientation relative to each other.

FAQ

Q1: How does the 2×2 stacked configuration benefit modern server designs? A: The 2×2 design provides 4 ports in a compact footprint, doubling the vertical port count compared to single-row cages. This allows manufacturers to increase total bandwidth per rack unit while saving precious PCB real estate.

Q2: Is the S2N3B23004BA4 reliable for use in unattended outdoor environments? A: Yes. By utilizing Press-Fit technology, the product uses mechanical interlocking rather than solder, eliminating risks of solder joint cracking from thermal stress or vibration. It offers a failure rate 10-30 times lower than traditional soldering, making it ideal for 5G base stations.

Q3: Can this cage prevent my optical transceivers from performance throttling? A: Absolutely. The “open-frame” design maximizes natural air convection, which has been measured to lower the core temperature of transceivers by 5-8°C. This prevents thermal-induced performance drops and ensures stable operation during massive data bursts.