68 Pin ZIF FPC Connector 0.5mm pitch top flip type, bottom contact F05045FA068M1WLJ9

The F05045FA068M1WLJ9 is a high-density, 68-pin Zero Insertion Force (ZIF) connector designed for Flexible Printed Circuits (FPC). Featuring a standard 0.50mm pitch and a low-profile vertical height of 2.1mm, this surface-mount assembly provides a reliable and space-efficient interconnection for advanced electronic devices.

Pitch	0.5mm
Number of Pins	68
Total Height	2.10mm
Body Width	6.0mm

F05045FA068M1WLJ9

Product Overview

According to the sources, this model belongs to the “Narrow Version” series, which utilizes a compact body width of 6.0mm to save valuable PCB real estate. The design incorporates a front-flip (actuator) locking mechanism and a bottom-contact interface. To ensure both mechanical stability and electrical signal integrity, the connector is equipped with integrated left and right grounding clips.

Product Specifications

Pitch: 0.50 mm.
Height: 2.1 mm.
Body Width: 6.0 mm (Narrow Version).
Number of Positions: 68 Pins.
Housing Material: White LCP (Liquid Crystal Polymer).
Actuator Material: Black LCP.
Terminal Material: Phosphor Copper.
Grounding Clips: Copper Alloy with Matte Tin plating.
Contact Area Plating: Gold plating (1u” Min) over a Nickel underplate (50~100u”).
Solder Area Plating: Matte Tin (80~160u”).

Product Features

ZIF Flip-Lock Mechanism: The front-flip actuator facilitates zero-force insertion of the FPC, protecting the delicate conductive gold fingers from mechanical damage.
Integrated Shielding: Features grounding clips on both sides to provide a secure grounding path for signal integrity and to enhance the mechanical strength of the solder joints.
Compact Footprint: The 6.0mm narrow width allows for high-density component placement on modern, multi-layered PCBs.
High-Temperature Resistance: Constructed with high-performance LCP thermoplastic, making it fully compatible with standard lead-free reflow soldering processes.
Reliable Conductivity: Selective gold plating in the contact area ensures low contact resistance and long-term environmental durability.

Applications

Given its high pin count and narrow profile, the sources suggest these connectors are typical for:

High-Resolution Displays: Connecting large LCD or OLED panels to main control boards.
Computing Hardware: Internal signal routing for slim laptops, tablets, and mobile devices.
Imaging Equipment: High-definition digital cameras and imaging sensor modules.
Automotive Electronics: Digital instrument clusters and infotainment system displays.

Packing Details

Packaging Type: Vacuum Packaging (抽真空包装).
Protection: The vacuum seal protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does the F05045FA068M1WLJ9 support grounding for EMI management?

Yes, this connector is designed “with grounding function” and includes integrated left and right copper alloy clips to provide a grounding path and secure the FPC.

2. Which direction must the FPC face for a proper connection?

This model is a bottom-contact design. The conductive traces or “gold fingers” of the FPC must face downward toward the PCB surface upon insertion.

3. What are the plating specifications for the solder tails?

The solder area is plated with Matte Tin (80~160u”) over a Nickel base to ensure high solderability and resistance to oxidation.