SFP+ Cage Connector - Elite 10G 25G 2X6 Stacked SFP+ Cage and Connector S2N3G23006BA4
Elite 10G 25G 2X6 Stacked SFP+ Cage and Connector S2N3G23006BA4
The S2N3G23006BA4 is an elite high-performance SFP+ Cage and Connector solution engineered for next-generation network architectures. This integrated SFP+ Cage and Connector assembly features a 2×6 stacked configuration providing 12 high-speed ports, utilizing advanced EMI shielding and superior thermal management to ensure zero-packet-loss signal integrity for AI, 5G, and data center environments.
| Heat Sink | No |
|---|---|
| Cage Connector Type | SFP+ |
| Light Pipe | Yes |
| Number of Ports | 2*6 |
| Terminal Tail | Press-Fit |
Product Overview
As part of Vitalconn’s market-proven SFP+ series, the S2N3G23006BA4 is designed to empower AI computing, 5G infrastructure, and cloud-network convergence. This 12-port stacked (ganged) assembly allows server OEMs to use compact server designs while doubling vertical port density. It serves as a robust physical foundation for enterprise core network upgrades, offering a perfect balance of performance and device compatibility.
Product Specifications
- Part Number: S2N3G23006BA4.
- Configuration: 2×6 Stacked (Total 12 ports).
- Interface Type: Integrated SFP+ Cage and Connector.
- Data Rate Support: Optimized for 10Gbps to 25Gbps per-channel speed spectrums.
- Manufacturing Precision: Features high-precision engineering with general tolerances reaching as tight as .XXX±0.10.
- Connection Technology: Optimized for high-reliability Press-Fit mechanical interlocking.
Product Features
- Superior EMI Shielding: Features multi-point beryllium copper grounding springs for a 360-degree full-circumference low-impedance electrical connection and precision shielding fingers to block high-frequency radiation.
- Advanced Thermal Management: Utilizes an open-frame structure with a precision top-punch array that acts as a “dedicated air conditioner,” measured to reduce transceiver core temperatures by 5-8°C.
- Press-Fit High Reliability: Fundamentally eliminates solder joint failure risks, offering a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering.
- Zero-Packet-Loss Signal Integrity: Simulation-optimized internal structures strictly control electromagnetic crosstalk between ports (<-40dB@10GHz).
- Intelligent Support: Fully supports hot-plug capabilities and Digital Diagnostic Monitoring (DDM/DOM).
Applications
- Data Centers: High-density Top-of-Rack (ToR) access and core-layer switch interconnects.
- 5G Communications: Stable physical-layer connections for base station AAU/DU units in both macro and micro station deployments.
- AI Infrastructure: Massive data throughput support for AI supercomputing clusters and real-time inference engines.
- Industrial & Telecom: Reliable connectivity for rail transit signal systems, industrial automation, and aerospace electronic equipment.
Packing Details
Following Vitalconn’s standard high-protection protocols, these components are typically packaged in blister trays. To ensure maximum component safety and shipping efficiency during transport, adjacent trays or units within the packaging are placed at a 180-degree horizontal orientation relative to each other.
FAQ
Q1: How does the 2×6 stacked configuration benefit server rack design? A: The 2×6 stacked design provides 12 high-speed ports in a single, compact footprint. This allows manufacturers to double the vertical port count compared to single-row designs, enabling more compact server architectures while significantly increasing total bandwidth per rack unit.
Q2: Can this cage assembly handle the heat from continuous high-speed data bursts? A: Yes. The S2N3G23006BA4 utilizes a precision “open-frame” top-punch array that maximizes natural air convection. This passive cooling system has been measured to lower core transceiver temperatures by 5-8°C, preventing thermal-induced performance drops.
Q3: Why is Press-Fit technology preferred for outdoor 5G base stations? A: Press-Fit technology uses cold-press mechanical interlocking that fundamentally eliminates the risk of solder joint cracking caused by thermal stress or vibration. It offers a reliability rate 10-30 times higher than traditional SMT soldering, making it ideal for unattended harsh environments.
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- High density SFP+ Cage and Connector
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