Superior ZIF FPC Connector 10 Pin 1.0mm Pitch 2.1mm Height F10045FA010M1WLJ9

Product Overview

Part of the “Narrow Version” series, this model is characterized by its compact 6.0mm body width, offering a balance between PCB space efficiency and structural stability. It utilizes a front-flip (actuator) locking mechanism and a bottom-contact design. To ensure excellent signal integrity and mechanical retention, the assembly is equipped with integrated left and right grounding clips.

Product Specifications

• Pitch: 1.00 mm.
• Height: 2.1 mm.
• Body Width: 6.0 mm (Narrow Version).
• Number of Positions: 10 Pins.
• Housing Material: White LCP (Liquid Crystal Polymer).
• Actuator Material: Black LCP.
• Terminal Material: Phosphor Copper.
• Grounding Clips: Copper Alloy.
• Plating: Contact area Gold (1u” Min); Solder area Matte Tin (80~160u”); Nickel base (50~100u”).

Product Features

• Zero Insertion Force (ZIF): Protects delicate FPC conductive gold fingers from mechanical damage during the insertion and locking process.
• Integrated Shielding: Features grounding functionality through integrated metal clips to provide a secure electrical path for EMI reduction and increased mechanical solder strength.
• Space-Efficient Profile: The 6.0mm narrow footprint allows for high-density placement on modern PCBs compared to wider 8.0mm variants.
• Thermal Durability: Constructed with high-performance LCP thermoplastic materials, making it fully compatible with standard lead-free high-temperature reflow soldering processes.
• Secure Locking: The front-flip actuator ensures a reliable mechanical connection and simple operation for assembly.

Applications

Given its 10-pin configuration and grounded narrow design, this connector is typically used in:

• Internal Signal Routing: Connecting peripheral modules to main logic boards in laptops and tablets.
• Display Interfaces: Secure connections for medium-sized LCD or OLED panels.
• Automotive Electronics: Reliable cabling for infotainment systems and digital dashboard modules.
• Industrial Controls: Interconnects in compact monitoring equipment subject to vibration.

Packing Details

• Packaging Type: Vacuum Packaging.
• Function: The vacuum seal protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does the F10045FA010M1WLJ9 provide grounding for EMI management? Yes, this model is designed “with grounding functionality” and includes integrated metal clips to manage electromagnetic interference and secure the FPC.

2. Which direction should the FPC conductive gold fingers face? This is a bottom-contact connector, meaning the conductive traces of the FPC must face downward toward the PCB surface during insertion.

3. Is the connector compatible with lead-free soldering processes? Yes, the housing and actuator are made of LCP (Liquid Crystal Polymer), a high-temperature material specifically chosen to withstand standard lead-free SMT reflow temperatures.

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