SFP+ Cage Connector - Elite High Density SFP+ 2X4 Cage Connector 10G Stacked S2N3D23000BA4
Elite High Density SFP+ 2X4 Cage Connector 10G Stacked S2N3D23000BA4
The S2N3D23000BA4 is an Elite High Density SFP+ 2X4 Cage Connector engineered to provide a robust physical foundation for modern communication infrastructure. This integrated SFP+ 2X4 Cage Connector utilizes a 2×4 stacked configuration to maximize port density in compact designs while ensuring superior signal integrity through advanced EMI shielding and thermal management.
| Heat Sink | No |
|---|---|
| Cage Connector Type | СФП+ |
| Light Pipe | No |
| Number of Ports | 2*4 |
| Terminal Tail | Press-Fit |
Product Overview
As a market-proven solution in Vitalconn’s high-speed portfolio, this 2×4 stacked (ganged) assembly is designed to empower AI computing, cloud-network convergence, and 5G infrastructure. It allows server OEMs to utilize compact designs while maintaining high port density, serving as a solid backplane foundation capable of handling massive traffic surges with microsecond-level low latency.
Product Specifications
- Part Number: S2N3D23000BA4.
- Configuration: 2×4 Stacked (8 ports total).
- Interface Type: Integrated SFP+ Cage and Connector.
- Data Rate: Optimized for 10Gbps per-channel speed spectrums.
- Manufacturing Precision: High-precision engineering with general tolerances reaching as tight as .XXX±0.10.
- Mounting Technology: Optimized for Press-Fit high-reliability mechanical interlocking.
Product Features
- Superior EMI Shielding: Features high-performance multi-point beryllium copper grounding springs for a 360-degree full-circumference low-impedance electrical connection and precision shielding fingers to block high-frequency radiation.
- Advanced Thermal Management: Utilizes an open-frame structure that acts as a “dedicated air conditioner” for transceivers, measured to reduce operating core temperatures by 5-8°C through enhanced natural air convection.
- Press-Fit High Reliability: Fundamentally eliminates solder joint failure risks, offering a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering, making it “fearless” in harsh environments.
- Zero-Packet-Loss Signal Integrity: Strictly controls electromagnetic crosstalk between ports (<-40dB@10GHz) to support stable data transmission.
Applications
- Data Centers: High-density ToR (Top-of-Rack) access and core-layer switch interconnects.
- 5G Communications: Stable physical-layer connections for base station AAU/DU units and edge computing nodes in outdoor environments.
- AI Infrastructure: Massive data throughput for AI training clusters supporting TB-level data exchange.
- Industrial Automation: Reliable signal transmission for rail transit, security surveillance, and industrial control networks.
Packing Details
Following standard high-protection protocols, these components are packaged in blister trays. To ensure maximum component safety and shipping efficiency, adjacent components within the tray are placed at a 180-degree horizontal orientation relative to each other.
FAQ
Q1: What are the primary space-saving benefits of the 2×4 stacked port configuration? A: The 2×4 configuration provides a total of 8 ports in a single, compact footprint. This design allows equipment manufacturers to double the vertical port count compared to single-row cages, enabling more compact server architectures while significantly increasing total bandwidth per rack unit.
Q2: How does Press-Fit technology handle the vibrations found in industrial or telecom environments? A: Press-Fit technology utilizes a cold-press mechanical connection that fundamentally eliminates the risk of solder joint cracking caused by thermal stress or vibration. This results in a connection that is 10-30 times more reliable than traditional SMT soldering, making it ideal for unattended harsh environments.
Q3: Can this cage assembly help prevent transceiver performance throttling? A: Yes. The cage is designed with an open-frame top-punch array that maximizes natural air convection. This “passive cooling” effect has been measured to lower the core temperature of transceivers by 5-8°C, ensuring stability and preventing thermal-induced performance drops during continuous high-speed data bursts.
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