SFP 2X2 Combo with Grounding Pin S1N3B23000CA4(Cross out AMPHENOL UE78-B2127-00321)

The S1N3B23000CA4 is a high-performance SFP 2X2 combo connector assembly designed by VITALCONN. This integrated solution features a stacked 4-port configuration (2 columns by 2 rows) equipped with grounding pins and clear light pipes to facilitate high-density networking connections with reliable EMI shielding and status indication.

S1N3B23000CA4_A0

Product Overview

This product provides a robust mechanical and electrical interface for SFP modules. It consists of a nickel-plated copper alloy cage for superior durability and shielding, combined with a high-temperature resistant connector housing. The design includes integrated stainless steel springs and phosphor bronze contacts with selective gold plating to ensure stable signal transmission in demanding environments.

Product Specifications

Cage Material: Copper Alloy, Nickel-plated, 0.25 mm thickness.
Light Pipe Material: Clear Polycarbonate.
Connector Housing: High-temperature LCP, UL 94 V-0 rated.
Contact Material: Phosphor Bronze, 0.20 mm thickness.
Plating: 30μ” min. Gold in mating area; 150μ” min. Matte Tin on solder tails.
Operating Temperature: -40°C to +85°C.
Storage Temperature: -55°C to +105°C.

Product Features

Stacked 2X2 Configuration: Maximizes port density on the PCB.
Integrated Grounding: Features dedicated grounding pins to ensure proper chassis grounding.
Visual Monitoring: Includes clear light pipes for easy port status monitoring.
High Durability: Built with stainless steel springs and precision-engineered copper alloy cages.
RoHS Compliant: Meets environmental safety standards for hazardous substances.

Applications

Based on its design as an SFP combo connector, typical applications include:

High-speed networking switches and routers.
Data center storage systems.
Telecommunications infrastructure.
Enterprise-level server connectivity.

Packing Details

Quantity per Tray: 18 pieces.
Quantity per Box: 90 pieces (comprising 5 stacked trays).
Box Dimensions: 340 mm x 265 mm x 200 mm.
Packaging Components: Trays, labels, and packaging tapes for secure transport.

FAQ

Q1. What is the benefit of the grounding pins in this SFP combo?

A1: The grounding pins (specifically noted as 1.05 mm diameter holes for chassis ground on the PCB layout) provide a direct path to the chassis ground, which is essential for reducing electromagnetic interference (EMI) and ensuring signal integrity in high-speed data transfers.

Q2. Can this connector withstand extreme environmental conditions?

A2: Yes, the product is designed to operate in a wide temperature range from -40°C to +85°C and can be stored in environments ranging from -55°C to +105°C, making it suitable for industrial-grade applications.

Q3. What are the materials used for the electrical contacts?

A3: The contacts are made of phosphor bronze with a thickness of 0.20 mm. For optimal conductivity and corrosion resistance, they feature 30μ” minimum gold plating in the mating area and matte tin on the solder tails.