USB Type-C 16 Pin Vertical SMT Receptacle Connector UC22-1E1H1A103-0HR-29 (Molex 2193200001)

The UC22-1E1H1A103-0HR-29 is a USB Type-C 16-pin vertical SMT receptacle connector featuring high-temp UL94 V-0 rated housing, stainless steel shell, and copper alloy gold-plated contacts. Available with or without grounding spring, rated for 10,000 mating cycles and 5 A on VBUS/GND pins. IR reflow compatible at 260°C peak. RoHS compliant. Tape-and-reel packaging.

UC22-XE1H1A103-XHR-29(UC22-1E1H1A103-0HR-29)

Product Overview


Part Number	UC22-1E1H1A103-0HR-29 (see variants below)
Connector Type	USB Type-C Receptacle
Number of Pins	16
Mounting Style	Vertical / Upright SMT
Variant Options	With spring or without spring
RoHS Compliant	Yes

Part Number Variants

Part Number	DIM A	DIM B	DIM C	DIM D	Spring	Qty/Reel	Qty/Box
UC22-1E1H1A103-0HR-29	8.80	4.45	9.75	2.10	With	450 pcs	4,500 pcs
UC22-2E1H1A103-0HR-29	9.20	4.95	10.20	1.70	With	450 pcs	4,500 pcs
UC22-3E1H1A103-0HR-29	10.45	6.20	11.40	0.45	With	450 pcs	4,500 pcs
UC22-1E1H1A103-1HR-29	8.80	4.45	9.75	2.10	Without	450 pcs	4,500 pcs
UC22-2E1H1A103-1HR-29	9.20	4.95	10.20	1.70	Without	450 pcs	4,500 pcs
UC22-3E1H1A103-1HR-29	10.45	6.20	11.40	0.45	Without	450 pcs	4,500 pcs

Product Specifications

Mechanical

Parameter	Value
Housing	High-temp plastic, UL94 V-0
Contact Material	Copper Alloy (C18150)
Shell / Mid Plate	Stainless Steel (SUS304)
Insertion / Removal Force	0.5–2.0 kgf / 0.8–2.0 kgf
Mating Cycles	10,000 cycles
Recommended PCB Thickness	1.0 ± 0.10 mm

Electrical

Parameter	Value
Voltage Rating	5 V DC/AC (RMS max)
Current — VBUS/GND Pins	5 A total
Current — CC Pin	1.25 A
Current — All Other Contacts	0.25 A
LLCR — VBUS, GND & Others	40 mΩ/pin max
LLCR Change of All Pins	10 mΩ max
Insulation Resistance	100 MΩ min
Dielectric Withstand Voltage	AC 100 V / 1 min

Environmental

Parameter	Value
Operating Temperature	-25°C ~ +85°C
IR Reflow Peak	260°C / 10 sec

16-Pin Signal Assignment

Pin	Signal	Pin	Signal
A1	GND	B1	GND
A2	VBUS	B2	VBUS
A3	CC1	B3	CC2
A4	D+	B4	D+
A5	D−	B5	D−
A6	SBU1	B6	SBU2
A7	VBUS	B7	VBUS
A8	GND	B8	GND

Product Features

USB Type-C 16-pin full-featured layout
Vertical SMT mounting for space-efficient PCB integration
Available with or without grounding spring to suit different EMC requirements
Stainless steel shell (SUS304) for superior EMI shielding
UL94 V-0 flame-retardant housing for safety-critical applications
Gold-plated contacts (Au 3 µin, Au 15 µin, or Au 30 µin options) for reliable, low-resistance performance
5 A VBUS/GND rating supports USB Power Delivery
10,000-cycle durability for long-life applications
IR reflow compatible — peak 260°C for automated SMT assembly
RoHS compliant

Applications

Consumer electronics & smart devices
IoT modules & edge computing hardware
Industrial control & automation systems
Automotive infotainment & ECUs
Wearables & portable medical devices
USB-PD chargers & power bank modules
Networking & communication equipment

Packing Details

Packaging	Embossed Tape & Reel
Qty / Reel	450 pcs
Qty / Box	4,500 pcs (10 reels)
Reel Diameter	Ø380 mm
Tape Width	16 mm
Peeling Angle	165°–180°

FAQ

Q1: What is the difference between the variants with and without a grounding spring?

The grounding spring variant (suffix -0HR) includes an integrated spring on the shield for enhanced EMI suppression and a more secure mechanical ground to the PCB. The non-spring variant (suffix -1HR) omits this spring and is suitable for applications where the PCB provides sufficient grounding or where spring retention is not required. Select based on your EMC design and mechanical retention requirements.

Q2: What gold plating thickness options are available for the contacts?

Three options are available per P/N code: Au 3 µin (03), Au 15 µin (15), and Au 30 µin (30) on the contact functional area. Au 3 µin suits standard consumer applications; Au 15 µin is recommended for industrial environments with higher mating cycles; Au 30 µin provides maximum durability and corrosion resistance for harsh conditions. All solder areas use Au 1 µin flash plating with Ni 50 µin underplating.

Q3: How does the IR reflow profile affect the connector, and what should I watch out for?

The connector tolerates a peak board temperature of 260°C maintained for 10 seconds during IR reflow. Ensure that the temperature profile does not exceed these values or extend the time above 260°C, as this may affect the UL94 V-0 housing material integrity. Recommended PCB thickness is 1.0 ± 0.10 mm with a default tolerance of ±0.05 mm on the PCB layout.