SFP+ Cage Connector - Superior High Density SFP+ 2X6 Cage Connector Interconnect Solution S2N3G23006BA4
Superior High Density SFP+ 2X6 Cage Connector Interconnect Solution S2N3G23006BA4
The S2N3G23006BA4 is a high-performance SFP Plus 2X6 Cage Connector assembly engineered for the most demanding network environments. This integrated SFP Plus 2X6 Cage Connector provides 12 high-speed ports in a stacked configuration, utilizing advanced EMI shielding and superior thermal management to ensure zero-packet-loss performance for 10G and 25G data transmissions.
| Heat Sink | No |
|---|---|
| Cage Connector Type | SFP+ |
| Light Pipe | Yes |
| Number of Ports | 2*6 |
| Terminal Tail | Press-Fit |
Product Overview
As a market-proven solution within Vitalconn’s interconnect family, this 2×6 stacked (ganged) assembly is designed to empower AI computing, cloud-network convergence, and 5G infrastructure. It allows server OEMs and cloud providers to utilize compact server designs without compromising signal integrity or device compatibility, offering a stable physical-layer foundation for enterprise core networks and high-performance computing clusters.
Product Specifications
- Part Number: S2N3G23006BA4.
- Configuration: 2×6 Stacked (12 ports).
- Interface Type: Integrated SFP+ Cage and Connector.
- Manufacturing Precision: High-precision engineering with general tolerances reaching .XXX±0.10.
- Connection Technology: Optimized for Press-Fit high-reliability mounting.
- Compatibility: Backward compatible with standard SFP modules to protect existing infrastructure investments.
Product Features
- Superior EMI Shielding: Features multi-point beryllium copper grounding springs for 360-degree low-impedance connections and precision shielding fingers to block high-frequency radiation.
- Advanced Thermal Management: The open-frame structure acts as a “dedicated air conditioner,” reducing transceiver operating core temperatures by 5-8°C through enhanced natural air convection.
- Press-Fit High Reliability: Utilizes mechanical interlocking that offers a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering, making it “fearless” in harsh environments.
- Zero-Packet-Loss Signal Integrity: Strictly controls electromagnetic crosstalk between ports (<-40dB@10GHz) through simulation-optimized internal structures.
Applications
- Data Centers: High-density ToR (Top-of-Rack) access and core-layer switch interconnects.
- 5G Communications: Stable physical-layer connections for base station AAU/DU units in outdoor environments.
- AI Infrastructure: Massive data throughput for AI training clusters supporting TB-level data exchange.
- Enterprise Networks: Core network upgrades and storage networks requiring 24/7 business continuity.
Packing Details
Components are packaged in blister trays. To ensure maximum component protection and shipping efficiency, adjacent blisters within the tray are placed at a 180-degree horizontal orientation relative to each other.
FAQ
Q1: What are the primary advantages of the 2×6 stacked port configuration? A: The 2×6 configuration provides a total of 12 high-speed ports in a single assembly, significantly increasing port density compared to single-row designs. This allows equipment manufacturers to maximize bandwidth in limited rack space, which is critical for hyperscale cloud data centers and AI servers.
Q2: How does the Press-Fit technology improve long-term reliability? A: Press-Fit technology uses a cold-press mechanical connection that fundamentally eliminates the risk of solder joint cracking caused by thermal stress or vibration. This results in a connection that is 10-30 times more reliable than traditional SMT soldering, ensuring a stable lifecycle for infrastructure in unattended harsh environments.
Q3: Can this cage assembly help prevent transceiver performance throttling? A: Yes. The cage features an open-frame top-punch array and optional high-conductivity heat spreaders that maximize natural air convection. These features have been measured to reduce the core temperature of transceivers by 5-8°C, which prevents performance throttling during massive data throughput and extends component life.
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