Ultimate H1.40 Flip-Cover Nano SIM Card Socket VTC402013032-A

Product Overview

The VTC402013032-A is a specialized Nano SIM card connector that utilizes a flip-cover design to ensure the card remains securely in place even under mechanical stress or vibration. With a mounting height of 1.40mm, it is optimized for modern mobile and IoT hardware. The component is constructed with a high-temperature LCP black housing and a durable stainless steel shell, making it compatible with automated SMT reflow soldering processes.

Product Specifications

• Part Number: VTC402013032-A.
• Card Type: Nano SIM.
• Profile Height: 1.40mm (H=1.40).
• Mechanism: Flip-cover / Hinged type.
• Housing Material: High-Temperature Thermoplastic (LCP Black).
• Terminal Material: C5191 Copper Alloy.
• Shell Material: Stainless Steel.
• Linear Tolerances: .X ±0.30mm, .XX ±0.20mm, .XXX ±0.10mm.
• Angular Tolerance: ±2°.
• Units: Millimeters (mm).

Product Features

• Secure Flip-Cover Design: The hinged stainless steel cover provides a mechanical lock that prevents accidental card ejection in high-vibration environments.
• Low-Profile Integration: The 1.40mm height allows for implementation in extremely thin portable devices without sacrificing mechanical strength.
• High-Temperature Reliability: The use of LCP (Liquid Crystal Polymer) for the housing ensures the socket maintains its structural integrity during industrial reflow soldering.
• Enhanced Durability: The stainless steel shell and C5191 copper alloy terminals are selected for their excellent mechanical properties and electrical conductivity.

Applications

• Mobile Communication: Slim smartphones, tablets, and mobile hotspots.
• IoT & M2M Modules: Cellular-enabled tracking devices, smart meters, and industrial sensors.
• Wearable Technology: Smartwatches and connected medical devices.
• Automotive Tech: In-vehicle telematics and infotainment systems requiring high-vibration resistance.

Packing Details While the specific packing quantities for the VTC402013032-A are not explicitly listed in its datasheet snippets, Vitalconn typically utilizes a standardized high-protection packaging system for its SMT card sockets:

• Primary Packaging: Components are loaded into Carrier Tape and sealed with Cover Tape on 13-inch (φ330mm) reels for automated pick-and-place assembly.
• Environmental Protection: Reels are sealed in PE Waterproof Bags with desiccant to prevent moisture ingress.
• Shipping Cartons: Multiple reels are packed into K=K cartons cushioned with Pearl Wool (EPE) and reinforced with triangular boards to absorb impacts during transit.

FAQs

1. What is the advantage of a flip-cover mechanism over a push-push type? The flip-cover (hinged) design provides a more secure mechanical lock, making it ideal for devices subject to high vibration or drops where a standard spring-loaded push-push mechanism might accidentally eject the card.
2. Can this socket withstand industrial reflow temperatures? Yes, the housing is made of high-temperature LCP thermoplastic, specifically chosen to withstand standard lead-free reflow soldering processes used in SMT assembly.
3. What is the vertical clearance required for this connector on a PCB? The VTC402013032-A has a mounting height of 1.40mm, which is the total vertical space it occupies on the surface of the board.