Robust Stacked 2×4 SFP Cage and Connector Press Fit PIN PN#S2N3D23000CA4

The S2N3D23000CA4 is a high-performance SFP cage and connector assembly featuring a 2×4 stacked configuration designed to maximize port density in high-speed network environments. This solution integrates advanced EMI shielding and superior thermal management to ensure stable data transmission, making it an essential component for AI servers and 5G infrastructure.

Heat Sink	No
Cage Connector Type	SFP+
Light Pipe	No
Number of Ports	2*4
Terminal Tail	Press-Fit

S2N3D23000CA4

Product Overview

As part of Vitalconn’s high-speed interconnect family, the S2N3D23000CA4 is engineered to empower tomorrow’s technologies, including cloud computing and AI supercomputing clusters. Its stacked 2×4 design allows server OEMs and cloud providers to utilize compact designs while maintaining reliable, low-latency physical-layer connections.

Product Specifications

Part Number: S2N3D23000CA4.
Configuration: 2×4 Stacked (Ganged) ports for high-density applications.
Connection Technology: Optimized for Press-Fit high-reliability mounting.
Material: High-performance beryllium copper grounding springs for 360-degree low-impedance electrical connections.
Interface Compatibility: Supports SFP series transceivers with hot-plug and DDM capabilities.

Product Features

Superior EMI Shielding: Utilizes multi-point grounding springs and a custom precision shielding finger design to fill housing gaps, effectively isolating interference and guaranteeing zero packet loss.
Advanced Thermal Management: The open-frame structure acts as a “dedicated air conditioner,” reducing transceiver core temperatures by 5-8°C through enhanced natural convection.
Press-Fit Reliability: Features mechanical interlocking that provides a FIT value 10-30x lower than traditional SMT soldering, fundamentally eliminating the risk of solder joint cracking in harsh environments.
Space Efficiency: Stacked belly-to-belly compatible design maximizes throughput per rack unit.

Applications

AI Supercomputing: Supports TB-level data exchange in AI training clusters and large-model inference centers.
5G Communications: Deeply aligned with 5G-Advanced and Open RAN evolution, suitable for base station AAU/DU units.
Cloud Data Centers: Ideal for core/aggregation-layer switch interconnects and high-density server access.
Industrial & Telecom: Reliable physical connectivity for rail transit, aerospace, and outdoor telecom nodes.

Packing Details

Components are packaged in blister trays. To ensure maximum protection and space efficiency, adjacent components within the tray are placed at a 180-degree horizontal orientation relative to each other.

FAQ

Q1: What are the benefits of the 2×4 stacked configuration? A: The stacked 2×4 design is specifically engineered for high-density environments. It allows equipment manufacturers to double the port count in the same horizontal rack space, significantly increasing bandwidth density while saving precious PCB real estate.

Q2: How does the Press-Fit technology improve reliability compared to standard soldering? A: Press-Fit technology uses a cold-press mechanical connection that eliminates the thermal stress associated with SMT soldering. This results in a FIT (Failure In Time) value that is 10-30x lower, making it “fearless” in environments subject to vibration or wide temperature fluctuations.

Q3: Can this cage help prevent my optical modules from overheating? A: Yes. The cage is designed with an open-frame top-punch array and optional high-conductivity heat spreaders. These features have been measured to reduce the core temperature of transceivers by 5-8°C, which helps prevent performance throttling and extends the life of the module.