30 Pin ZIF FPC Connector 1.0mm Pitch Height 2.1mm F10040FA030M1WLJ9

The F10040FA030M1WLJ9 is a high-performance Zero Insertion Force (ZIF) connector designed for Flexible Printed Circuits (FPC). This surface-mount component features a 1.00mm pitch and a low-profile 2.1mm height, providing a reliable high-density interconnect solution for sophisticated electronic assemblies.

Pitch	1.0mm
Number of Pins	30
Total Height	2.10mm
Body Width	8.0mm

F10040FA030M1WLJ9

Product Overview

As part of the “Wide Version” series, this connector is designed with a robust body width of 8.0mm to ensure superior mechanical stability on the PCB. It utilizes a front-flip (actuator) locking mechanism and a bottom-contact design. The assembly includes integrated grounding functionality to maintain signal integrity and enhance the mechanical strength of the solder joints.

Product Specifications

Pitch: 1.00 mm.
Height: 2.1 mm.
Body Width: 8.0 mm (Wide Version).
Number of Positions: 30 Pins.
Housing Material: White LCP (Liquid Crystal Polymer).
Actuator Material: Black LCP.
Terminal Material: Phosphor Copper.
Grounding Clips: Copper Alloy.
Contact Area Plating: Gold plating (1u” Min) over a Nickel base (50~100u”).
Solder Area Plating: Matte Tin (80~160u”).

Product Features

ZIF Flip-Lock Design: The front-flip actuator allows for zero-force insertion of the FPC, protecting delicate conductive “gold fingers” from mechanical wear during assembly.
Integrated Shielding: Equipped with grounding clips on both sides to provide a secure grounding path for EMI reduction and increased solder strength.
High-Temperature Durability: The LCP thermoplastic housing is designed to withstand standard lead-free reflow soldering temperatures.
Robust Footprint: The 8.0mm wide body provides maximum stability on the PCB, even in environments subject to vibration.
Reliable Connectivity: Selective gold plating on contact areas ensures low contact resistance and long-term environmental stability.

Applications

Given its 30-pin configuration, 1.0mm pitch, and grounded design, this connector is typically used in:

Display Interfaces: Connecting LCD or OLED panels to main control boards.
Computing Hardware: Internal signal routing for laptops, tablets, and handheld gadgets.
Automotive Systems: Infotainment screens and digital instrument cluster connections.
Industrial/Medical: Compact diagnostic imaging and high-density monitoring equipment.

Packing Details

Packaging Type: Vacuum Packaging.
Protection: The vacuum seal protects the gold-plated terminals from environmental oxidation and prevents moisture absorption by the LCP housing.

FAQ (Frequently Asked Questions)

1. What is the contact orientation for the F10040FA030M1WLJ9?

This model is a bottom-contact connector, meaning the conductive gold fingers of the FPC must face downward toward the PCB for a successful connection.

2. Does this 30-pin connector support grounding for signal integrity?

Yes, it is designed with grounding functionality and includes integrated metal clips to secure the FPC and provide an electrical grounding path.

3. Is the connector compatible with lead-free soldering processes?

Yes, the housing and actuator are made of LCP (Liquid Crystal Polymer), a high-performance material capable of withstanding the temperatures required for lead-free reflow soldering.