SFP+ 2×2 Stacked Cage Connector S2N3B23000BA4 Cross-Reference Alternative to Molex 760455001

バイタルコン S2N3B23000BA4 is a form-fit-function drop-in replacement for the Molex 760455001 — same PCB footprint, bezel cutout, and 20-pin signal interface. No board re-design required. SFP+/SFP compliant per SFF-8431/SFF-8432.

2-row × 2-port stacked configuration (4 SFP+ ports)
Nickel-plated copper alloy cage, 0.25 mm wall thickness
Stainless steel EMI spring fingers for FCC/CE compliant shielding
20-pin edge-card connector, 15μ” min gold on mating contacts
Operating temperature: −40°C to +85°C

S2N3B23000BA4

Cross-Reference — Key Parameters at a Glance

Parameter	VITALCONN S2N3B23000BA4	Molex 760455001	Match
Configuration	2×2 Stacked (4-port)	2×2 Stacked (4-port)	✅
MSA Standard	SFF-8431 / SFF-8432 / INF-8074i	SFF-8431 / SFF-8432 / INF-8074i	✅
Overall Length	63.25 mm	63.25 mm	✅
Bezel Cutout (W × D)	29.80 × 26.00 mm	29.80 × 26.00 mm	✅
Cage Vertical Width	29.00 +0.20 mm	29.00 ±0.20 mm	✅
Port Spacing	14.25 mm TYP	14.25 mm TYP	✅
PCB Ground Hole Ø	1.85 ±0.05 mm (21 holes)	1.85 ±0.05 mm (21 holes)	✅
PCB Signal Hole Ø	1.05 ±0.05 mm	1.05 ±0.05 mm	✅
Pin Layout	T1–T20, L1–L20	T1–T20, L1–L20	✅
Light Pipe Zones	4 (2 inner + 2 outer)	4 (2 inner + 2 outer)	✅
Cage Material	Copper alloy, Ni-plated	Nickel Silver	⚡
EMI Spring	Stainless steel	Phos-bronze	⚡
Contact Alloy	Phosphor bronze	Tin brass	⚡
Contact Gold Plating	15μ” min (30μ” optional)	30μ” (0.76 μm)	⚡
Solder Tail Plating	Matte tin, RoHS	Matte tin, RoHS	✅
Operating Temp.	−40°C to +85°C	−40°C to +85°C	✅
Connector Housing	LCP, UL94 V-0	LCP, UL94 V-0, Black	✅
Mounting Type	Press-fit / solder tail	Press-fit / solder tail	✅
RoHS	Yes	Yes	✅

✅ = Identical | ⚡ = Material differs, function identical — no impact on drop-in compatibility

Drop-In Replacement — Verified

Dimension	S2N3B23000BA4	Molex 760455001
Bezel Opening (W × D)	29.80 ±0.10 × 26.00 ±0.10	29.80 ±0.10 × 26.00 ±0.10
Bezel Above PCB	3.50 ±0.30	3.50 ±0.30
Min. Bezel Cutout Spacing	31.55 MIN	31.52 MIN
PCB Ground Holes (qty)	21	21
Cage Wall Thickness	0.25 mm	0.25 mm
Module Mating Cycles	500+ (15μ”) / 10,000+ (30μ”)	500+

No PCB layout changes, tooling modifications, or re-qualification required. The S2N3B23000BA4 drops directly onto any board designed for the 760455001 footprint.

Applications

Enterprise Switches — 10G/25G aggregation and ToR platforms

Data Centers — High-density SFP+ port deployment per rack unit

Telecom Infrastructure — 5G fronthaul, FTTA, optical line terminals

Industrial Ethernet — Ruggedized connectivity in vibration environments

Network Test Equipment — Hot-pluggable with high mating cycle durability

FAQ

Q1: Can I drop the S2N3B23000BA4 directly into my existing PCB designed for Molex 760455001?

Yes. All PCB footprints, hole positions, bezel cutouts, and pin layouts are identical. No redesign needed.

Q2: Do the material differences affect signal integrity?

No. The 20-pin pinout, contact geometry, and impedance design are identical. EMI shielding effectiveness is equivalent. VITALCONN offers 30μ” gold upgrade for high-cycle applications — contact us for qualification data.

Q3: Are light pipe variants available (matching Molex 760455002/003)?

Yes. Variants with inner-only or outer-only light pipes are available. Contact sales for part numbers.

Ordering

P/N	VITALCONN S2N3B23000BA4
Cross-Reference	Molex 760455001
Packaging	Tray (18 pcs/tray, 90 pcs/box)
Samples	Available upon request

Disclaimer: All referenced Molex part numbers are property of Molex Incorporated. This cross-reference is provided for engineering comparison only and does not imply any affiliation. Verify compatibility in your application.

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