Micro SD Push-Push Card Socket H1.25mm C102316832E1

The VITALCONN C102316832E1 is a 1.25mm-height Push-Push Micro SD (TF) card socket connector with 8 contacts. Features dual detection switches, stainless steel shell, LCP insulator, gold-plated copper alloy contacts, and tape-and-reel packaging. Rated 5V/0.5A, -40C to +85C, RoHS compliant.

Product Type	Push-Push Micro SD Card Socket
Mounting Height	1.25mm
Number of Contacts	8
Card Detection	Dual Switches (DSW1 + DSW2)
Insulator Material	Glass-filled LCP, UL94V-0
Contact Material	Copper Alloy, Au 1µ" min over Ni
Shell Material	Stainless Steel, Ni 50µ" + Au 1µ" min
Rated Voltage	5V DC
Rated Current	0.5A
Operating Temperature	-40°C to +85°C
Compliance	RoHS Compliant

Product Overview

The C102316832E1 is a compact Push-Push Micro SD (TF) card socket connector with a 1.25mm mounting height, designed for high-density PCB integration in space-constrained portable and embedded applications. This top-mount socket from バイタルコン features a smooth Push-Push locking mechanism, dual detection switches (DSW1/DSW2) for card presence sensing, and a robust stainless steel shell for mechanical durability. The integrated spring, cam follower, and lock assembly ensure reliable card insertion and ejection through 10,000 mating cycles. With gold-plated copper alloy contacts and an LCP glass-filled insulator, the C102316832E1 delivers stable signal integrity at 5V/0.5A and operates reliably from -40°C to +85°C. Supplied in tape-and-reel packaging (2,000 pcs/reel, 20,000 pcs/box), it is ideal for SMT high-volume assembly in consumer electronics, IoT devices, dash cams, drones, wearables, and industrial controllers.

Product Specifications

Part Number: C102316832E1
Product Type: Push-Push Micro SD (TF) Card Socket Connector
Mounting Height: 1.25mm
Number of Contacts: 8
Card Detection: Dual switches (DSW1 / DSW2)
Insulator Material: Glass-filled LCP, UL94V-0
Housing Material: High Temperature Thermoplastic, Shell Stainless Steel
Contact Material: Copper Alloy, Au 1µ” min over Ni underplate
Shell Material: Stainless Steel, 50µ” Ni underplate, Au 1µ” min on contact and solder areas
Spring / Cam Follower / Lock: Stainless Steel
Eject Lever: Glass-filled NY
Rated Voltage: 5V DC
Rated Current: 0.5A
Contact Resistance: 100mΩ max (initial)
Insulation Resistance: 1000MΩ min
Dielectric Withstand Voltage: 500V DC for 1 minute
Operating Temperature: -40°C to +85°C
Operating Humidity: 80% R.H. max
Compliance: RoHS Compliant

Micro SD Push-Push Card Socket Key Features

Ultra-Low 1.25mm Profile

Compact 1.25mm mounting height enables integration into ultra-thin portable devices such as wearables, action cameras, and slim IoT gateways without sacrificing card socket functionality.

Push-Push Locking Mechanism

Smooth push-to-insert and push-to-eject mechanism with stainless steel spring, cam follower, and lock assembly ensures reliable card retention and effortless removal through the full mating cycle life.

Dual Card Detection Switches

Integrated DSW1 and DSW2 detection switches provide real-time card presence feedback to the host controller, enabling safe power management and data integrity checks.

Robust Stainless Steel Shell

Stainless steel top cover and lock components with 50µ” nickel underplate and 1µ” gold flash deliver excellent mechanical strength, EMI shielding, and corrosion resistance for industrial-grade reliability.

Premium Contact Plating

Copper alloy contacts with 1µ” minimum gold over nickel underplate ensure low contact resistance (100mΩ max), high conductivity, and long-term signal integrity in repeated mating cycles.

High-Temperature LCP Insulator

Glass-filled LCP (Liquid Crystal Polymer) insulator offers superior thermal stability, chemical resistance, and dimensional precision, with UL94V-0 flame-retardant rating for safety compliance.

Wide Operating Temperature Range

Rated for -40°C to +85°C operation with 80% R.H. max humidity tolerance, suitable for outdoor, industrial, automotive, and consumer electronics applications.

SMT Tape-and-Reel Packaging

Supplied in 2,000 pcs/reel carrier tape with 20,000 pcs per box (350×350×340mm) for fully automated SMT pick-and-place assembly, reducing manufacturing cost and improving throughput.

Packing Details

Reel Quantity: 2,000 pcs per plate/reel
Carton Quantity: 20,000 pcs per box
Carton Dimensions: 350 × 350 × 340 mm
Packaging Type: Carrier tape on reel, 24mm wide, 10-reel pack
Carton Protection: Top and bottom of carton padded with pearl cotton, secured with packaging tape and label

Applications

Wearable devices (smart watches, fitness trackers, AR/VR headsets)
Action cameras, dash cams, and body cameras
Drones, RC vehicles, and robotics
IoT gateways, smart home controllers, and edge computing devices
Portable medical devices and health monitors
Industrial controllers and HMI panels
POS terminals and handheld scanners
Automotive infotainment and telematics control units

Frequently Asked Questions

Q: What does “Push-Push” mean in the context of this card socket?

A: Push-Push is a card locking mechanism where the Micro SD card is inserted by pushing it in until it clicks into place, and ejected by simply pushing it again. The internal cam follower, spring, and lock assembly handle the locking and release action smoothly, typically rated for 10,000 mating cycles.

Q: What is the difference between Push-Push and Push-Pull mechanisms?

A: Push-Push mechanisms use an internal spring/latch to lock and release the card with a second push, while Push-Pull mechanisms require the user to pull the card out directly. Push-Push designs are generally preferred for consumer electronics where smooth, single-action ejection and protection against accidental removal are important.

Q: How do the dual detection switches (DSW1/DSW2) work?

A: DSW1 and DSW2 are mechanical switches that open or close when a card is fully inserted or removed. The host controller can monitor both switch states to determine whether a card is present, fully seated, or in the process of ejection, enabling safe power sequencing and data access control.

Q: Is this socket compatible with standard Micro SD and Micro SDHC/SDXC cards?

A: Yes, the C102316832E1 accepts all standard Micro SD form-factor cards including Micro SD, Micro SDHC, and Micro SDXC up to the maximum capacity supported by the host device. The 8-contact pinout supports the full SD specification bus.

Q: Can this card socket withstand reflow soldering processes?

A: Yes, the high-temperature LCP insulator and stainless steel shell are designed to withstand standard lead-free SMT reflow profiles, with peak temperatures up to 260°C as commonly used in lead-free assembly processes.

Q: What is the recommended PCB layout and mounting orientation?

A: The C102316832E1 is a top-mount socket with SMT terminals. The recommended PCB layout, pad dimensions, and keep-out zones are provided in the product drawing. The card insertion direction is from the top of the connector, parallel to the PCB surface.

Micro SD Push-Push Card Socket H1.25mm C102316832E1 Product Specification