SFP Cage&CONN Connector

VITALCONN’s SFP cage connector portfolio are engineered to support high-speed data transmission, with capabilities extending up to 28G NRZ and 56G PAM-4. Our comprehensive range includes SFP, SFP+, SFP28, SFP56, and SFP-DD products, allowing you to select the optimal solution based on your specific device architecture requirements—such as PCB space constraints, speed demands, channel count, and port density. All our SFP connectors incorporate Surface-Mount Technology (SMT) and are available in various cage configurations, including single-port (1×1), multi-port (1×N), and stacked-port (2×N) layouts to accommodate diverse design needs. To enhance performance and adaptability, these cage connectors offer optional heat sinks for improved thermal management and light pipes for status indication. For termination, we provide both Press-Fit and Soldering Tail options to suit different assembly processes. Utilize the part selection guide below to identify the ideal component for your application. 

 

Cage Connector Type:

Number of Ports:

Light Pipe:

Heat Sink:

Terminal Tail:

Cage Connector Type:

  • 2X2 Stacked SFP+ Cage
    SFP+ Cage Connector
    Elite 10G 2X2 Stacked SFP+ Cage and Connector S2N3B23000BA4

    The S2N3B23000BA4 is an Elite high-performance SFP+ Cage and Connector assembly designed for high-density networking environments. This integrated SFP+ Cage and Connector solution features a 2×2 stacked configuration that supports 10G data rates while providing industry-leading EMI suppression and thermal management to ensure zero-packet-loss signal integrity.

  • 2X2 stacked SFP Cage Connector
    SFP Cage Connector
    Elite High Density SFP Cage Connector 2X2 Combo S1N3B23000CA4 Replacement of UE78-B2127-00321

    The S1N3B23000CA4 is an Elite High Density SFP Cage Connector featuring a 2×2 combo configuration with dedicated grounding pins. This advanced SFP Cage Connector is engineered to provide a robust physical foundation for network infrastructure, ensuring stable signal transmission through superior EMI shielding and advanced thermal management.

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