Robust ZIF FPC Connector 18 Pin 0.5mm Pitch 2.1mm High F05057FA018M1WLJ9

The ZIF FPC Connector F05057FA018M1WLJ9 is a high-reliability surface-mount interconnect solution designed for sophisticated electronic assemblies. Featuring an 18-pin configuration with a standard 0.50mm pitch and a 2.1mm low-profile height, it provides a stable and secure interface for Flexible Printed Circuits (FPC) in high-density environments.

Pitch	0.5mm
Number of Pins	18
Body Width	6.0mm
Total Height	2.10mm

F05057FA015M1WLJ9

Product Overview

This model is part of the “Wide Version” series, distinguished by a robust 8.0mm body width that offers superior mechanical stability on the PCB. It utilizes a front-flip (actuator) locking mechanism and a bottom-contact design. The assembly is integrated with left and right grounding clips to ensure signal integrity and enhance mechanical solder strength.

Product Specifications

Pitch: 0.50 mm.
Height: 2.1 mm.
Body Width: 8.0 mm (Wide Version).
Number of Positions: 18 Pins.
Housing Material: White LCP (Liquid Crystal Polymer).
Actuator Material: Black LCP.
Terminal Material: Phosphor Copper.
Grounding Clips: Copper Alloy.
Plating: Contact area Gold (1u” Min); Solder tails Matte Tin (80~160u”); Nickel base (50~100u”).

Product Features

Zero Insertion Force (ZIF): Facilitates effortless FPC insertion, protecting delicate conductive gold fingers from mechanical wear during assembly.
Flip-Lock Design: The front-flip actuator ensures a secure mechanical connection and easy operation for technicians.
Integrated Shielding: Features grounding functionality through metal clips to provide a secure electrical path for EMI reduction and increased mechanical stability.
Thermal Durability: Constructed with high-performance LCP thermoplastic materials, making it fully compatible with standard lead-free reflow soldering processes.
Robust Footprint: The 8.0mm width ensures maximum adhesion and structural reliability on the PCB compared to narrower variants.

Applications

Display Interfaces: Connecting LCD or OLED panels to main control boards in mobile devices and tablets.
Automotive Electronics: High-density signal routing for digital instrument clusters and infotainment systems.
Consumer Electronics: Internal cabling for premium smartphones, wearables, and handheld diagnostic tools.
Industrial Equipment: Secure interconnections in vibration-prone monitoring and control systems.

Packing Details

Packaging Type: Vacuum Packaging.
Function: Protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does the F05057FA018M1WLJ9 support grounding for signal integrity? Yes, this model is designed “with grounding function” and includes integrated left and right copper alloy clips to provide a secure grounding path and manage EMI.

2. Which direction should the FPC conductive gold fingers face? This connector utilizes a bottom-contact design, meaning the conductive traces of the FPC must face downward toward the PCB surface during insertion.

3. What is the benefit of the “Wide Version” body for this 18-pin connector? The 8.0mm wide body provides a larger soldering footprint on the PCB, which significantly improves mechanical retention and stability compared to narrower versions, making it ideal for high-vibration environments.

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