Elite High Density SFP+ Cage Connector 2X4 Stacked S2N3D23005BA4

The S2N3D23005BA4 is an Elite High Speed SFP+ Cage Connector designed for high-density networking applications. This integrated SFP+ Cage Connector solution features a 2×4 stacked configuration that supports 10G/25G data rates while providing superior EMI shielding and thermal management to ensure zero-packet-loss performance.

Heat Sink

No

Cage Connector Type

SFP+

Light Pipe

Yes

Number of Ports

2*4

Terminal Tail

Press-Fit

Product Overview

As a core component of Vitalconn’s high-speed portfolio, the S2N3D23005BA4 is engineered to empower AI computing, 5G infrastructure, and cloud-network convergence. This 2×4 stacked (ganged) assembly allows server OEMs to use compact designs while doubling vertical port density, providing a robust physical foundation for modern intelligent computing centers.

Product Specifications

  • Part Number: S2N3D23005BA4.
  • Port Configuration: 2×4 Stacked (8 ports total).
  • Speed Spectrum: Optimized for SFP+ (10G) and SFP28 (25G) applications.
  • Manufacturing Tolerance: Precision engineering with general tolerances reaching .XXX±0.10.
  • Electrical Performance: Internal structure strictly controls electromagnetic crosstalk to <-40dB@10GHz.
  • Connection Type: Optimized for Press-Fit high-reliability mounting.

Product Features

  • Superior EMI Shielding: Features 360-degree full-circumference grounding springs made of high-performance beryllium copper to eliminate contact resistance and isolate interference.
  • Advanced Thermal Management: The open-frame structure acts as a “dedicated air conditioner,” measured to reduce transceiver core temperatures by 5-8°C through enhanced air convection.
  • Press-Fit High Reliability: Utilizes mechanical interlocking that provides a FIT value 10-30x lower than traditional SMT soldering, making it “fearless” in harsh outdoor environments.
  • Standard Compatibility: Supports Hot-Plug and Digital Diagnostic Monitoring (DDM/DOM) while remaining backward compatible with standard SFP modules.

Applications

  • Data Centers: High-density ToR (Top-of-Rack) access and core-layer switch interconnects.
  • 5G Communications: Stable physical-layer connections for base station AAU/DU units and edge computing nodes.
  • Artificial Intelligence: Massive data exchange for AI supercomputing clusters and large-model training.
  • Enterprise Networks: Reliable infrastructure for virtualization, databases, and mission-critical systems.

Packing Details

Following standard safety protocols, components are packaged in blister trays. To ensure maximum protection and space efficiency during transport, adjacent components within the tray are placed at a 180-degree horizontal orientation relative to each other.


FAQ

Q1: What are the primary space-saving benefits of the 2×4 stacked configuration? A: The 2×4 stacked design provides 8 high-speed ports in a single assembly, doubling the vertical port count compared to single-row cages. This allows equipment manufacturers to maximize bandwidth in limited rack space, which is critical for hyperscale cloud data centers and AI servers.

Q2: How does the Press-Fit technology handle vibration in 5G base stations? A: Press-Fit technology uses a cold-press mechanical connection that fundamentally eliminates the risk of solder joint cracking caused by vibration or thermal stress. Its failure rate (FIT value) is 10-30 times lower than traditional soldering, ensuring a lifetime of reliable connection in unattended harsh environments.

Q3: Can this cage prevent performance throttling in high-speed transceivers? A: Yes. By using an open-frame top-punch array and optional high-conductivity heat spreaders, this cage reduces the core temperature of transceivers by 5-8°C. This prevents thermal buildup, allowing the equipment to unleash its peak performance during massive data throughput.

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