1.56mm Push Push Micro SIM Card Socket Reliable VTC102312072

The VTC102312072 is a professional-grade Micro SIM Card Socket designed for high-performance cellular connectivity in space-constrained mobile devices. Featuring a reliable push-push ejection mechanism and a low-profile 1.56mm profile, this connector ensures secure card retention and stable signal integrity for Micro SIM (3FF) applications in modern hardware.

 

Card Detect Switch

Yes

Card Holder No. of positions

9

Card Holder Type

Micro SIM

Card Removal Method

Push in/Auto eject out

Product Overview

The VTC102312072 is a precision Micro SIM card connector featuring a mounting height of 1.56mm. It utilizes a push-push mechanism for easy card insertion and removal and is designed for surface-mount technology (SMT) with external solder leads. Constructed with heat-resistant LCP black plastic and a durable stainless steel shell, it is optimized for high-density, slim electronic designs.

Product Specifications

  • Part Number: VTC102312072.
  • Standard: Micro SIM.
  • Mechanism Type: Push-Push.
  • Mounting Height: 1.56mm.
  • Mounting Style: SMT (External Solder Leads).
  • Housing Material: High-Temperature LCP Black.
  • Terminal Material: C5191 Copper Alloy.
  • Shell Material: Stainless Steel.
  • Linear Tolerances: .X ± 0.30mm, .XX ± 0.20mm, .XXX ± 0.10mm.
  • Angular Tolerance: ± 2°.

Product Features

  • Tactile Push-Push Mechanism: Provides an intuitive locking and spring-loaded ejection system for convenient card handling.
  • Ultra-Slim Profile: The 1.56mm height allows for integration into slim handheld electronics without sacrificing mechanical strength.
  • Thermal Resilience: The LCP black housing ensures the connector maintains structural integrity during standard industrial reflow soldering processes.
  • Robust Shielding: Equipped with a stainless steel shell that provides physical protection and stable mechanical mounting on the PCB.
  • External Solder Reliability: Features external solder tails for reliable electrical connections and easier solder joint inspection.

Applications (Note: These are standard applications for this type of Micro SIM connector based on general industry standards within the sources.)

  • Mobile Communication: Smartphones, tablets, and ultra-thin laptops.
  • Internet of Things (IoT): Connected smart meters, cellular sensors, and industrial tracking units.
  • Portable Hardware: Mobile Wi-Fi hotspots and handheld wireless modules.
  • Automotive Tech: Integrated telematics and infotainment systems.

Packing Details (Note: Based on standard Vitalconn packaging procedures for SMT components.) Products are typically supplied in Carrier Tape and Reel format to support high-speed automated pick-and-place assembly. For shipping, reels are sealed in PE Waterproof Bags with desiccant and packed into reinforced K=K cartons. To ensure safety during transit, the cartons are cushioned with Pearl Wool (EPE) and reinforced with triangular boards.


FAQs

  1. What is the vertical profile height of the VTC102312072? The socket occupies a low-profile mounting height of 1.56mm above the PCB.
  2. How is the Micro SIM card ejected from this model? It uses a push-push mechanism, where the card is pushed to lock it in place and pushed again to trigger the internal spring for ejection.
  3. Is this connector suitable for high-temperature automated assembly? Yes, it is an SMT component constructed with LCP black plastic, specifically designed to withstand standard automated reflow soldering temperatures.
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