FPC Connector

Vitalconn’s series of Zero Insertion Force (ZIF) FPC connectors are precision-engineered for high-density, low-profile electronic applications. These connectors feature a standard 0.50mm pitch and a compact vertical height of 2.1mm, making them an ideal space-saving solution for modern PCB designs.

The product line is highly versatile, offering a wide range of positions from 10-pin up to 96-pin configurations to meet various data transmission requirements. Each connector is constructed with a high-performance LCP (Liquid Crystal Polymer) main body and a black flip actuator, facilitating a secure and easy flip-lock mechanism for circuit insertion.

To ensure long-term reliability and superior electrical conductivity, the terminals feature selective gold plating (1u” Min) in the contact area and matte tin plating in the solder area. Additionally, these connectors are equipped with integrated left and right grounding clips made of copper alloy, which enhance mechanical retention and support signal integrity. For protection during transit and storage, all components are delivered in vacuum packaging to prevent environmental oxidation.

Number of Pins:

Total Height

Pitch:

Body Width:

  • FPC Connector
    FPC Connector
    8 Pin 1.0mm Pitch ZIF FPC Connector F10041FA008M1WL-DJ9

    The F10041FA008M1WL-DJ9 is a precision-engineered Zero Insertion Force (ZIF) connector designed for Flexible Printed Circuits (FPC). This surface-mount component features a 1.0mm pitch and a low-profile 2.1mm height, providing a reliable high-density connection for compact electronic assemblies. With its 8-pin configuration, it offers a secure and efficient interface for various data and power transmission needs. 

  • VITALCONN FPC Connector
    FPC Connector
    8 Pin ZIF FPC Connector 1.0mm Pitch Height 2.1mm F10041FA008M1WL-DJ9

    The F10041FA008M1WL-DJ9 is a high-reliability, 8-pin Zero Insertion Force (ZIF) connector designed for Flexible Printed Circuits (FPC). This surface-mount component features a 1.0mm pitch and a low-profile 2.1mm height, providing a secure and space-efficient interconnection for high-density electronic assemblies.

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