Robust High Speed SFP Plus Cage and Connector 2X4 Stacked S2N3D23006PA4

The S2N3D23006PA4 is a high-performance SFP Plus Cage and Connector assembly engineered to deliver elite port density and signal integrity for next-generation network architectures. This integrated SFP Plus Cage and Connector solution features a 2×4 stacked configuration, optimized to support 10G and 25G data rates while providing industry-leading EMI suppression and thermal dissipation.

Heat Sink

رقم

Cage Connector Type

SFP +

Light Pipe

نعم

Number of Ports

2*4

Terminal Tail

Press-Fit

Product Overview

As a core component of Vitalconn’s high-speed portfolio, the S2N3D23006PA4 is designed to empower AI computing, cloud-network convergence, and 5G infrastructure. Its stacked 2×4 (ganged) design allows server OEMs and cloud providers to utilize compact server designs while doubling vertical port density, providing a robust physical foundation for hyper scale data centers and high-performance computing (HPC) clusters.

Product Specifications

  • Part Number: S2N3D23006PA4.
  • Configuration: 2×4 Stacked (8 ports total).
  • Interface Type: Integrated SFP+ Cage and Connector.
  • Manufacturing Precision: High-precision engineering with general tolerances reaching .XXX±0.10.
  • Connection Technology: Optimized for Press-Fit high-reliability mounting.
  • Material: High-performance beryllium copper grounding springs for 360-degree low-impedance electrical connections.

Product Features

  • Superior EMI Shielding: Features multi-point grounding springs and a precision shielding finger design to fill housing gaps, effectively isolating external interference and guaranteeing zero packet loss.
  • Advanced Thermal Management: The open-frame structure acts as a “dedicated air conditioner,” measured to reduce transceiver operating core temperatures by 5-8°C through enhanced natural air convection.
  • Press-Fit High Reliability: Utilizes mechanical interlocking that fundamentally eliminates solder joint failure risks, offering a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering.
  • Zero-Packet-Loss Signal Integrity: Strictly controls electromagnetic crosstalk between ports (<-40dB@10GHz) through simulation-optimized internal structures.

Applications

  • Data Centers: High-density ToR (Top-of-Rack) access and core-layer switch interconnects.
  • AI Infrastructure: Massive data throughput for AI training clusters supporting TB-level data exchange.
  • 5G Communications: Stable physical-layer connections for base station AAU/DU units and Open RAN evolution.
  • Industrial & Telecom: Reliable physical connectivity for rail transit, aerospace, and outdoor telecom nodes.

Packing Details

Following Vitalconn’s standard high-protection protocols, components are packaged in blister trays. To ensure maximum component safety and space efficiency during transport, adjacent components within the tray are placed at a 180-degree horizontal orientation relative to each other.


FAQ

Q1: What are the primary space-saving benefits of the 2×4 stacked configuration? A: The 2×4 design provides a total of 8 high-speed ports in a single, compact footprint, allowing equipment manufacturers to significantly increase port density per rack unit. This enables the creation of more compact server and switch designs without compromising bandwidth capacity.

Q2: How does this cage connector ensure stable operation in harsh environments? A: The product utilizes Press-Fit technology, which uses cold-press mechanical connections rather than solder. This eliminates risks like thermal stress and solder joint cracking, providing a connection that is 10-30 times more reliable than traditional soldering, making it ideal for outdoor or high-vibration environments.

Q3: Can the S2N3D23006PA4 help prevent performance throttling in optical modules? A: Yes. Its advanced “dedicated air conditioner” design uses an open-frame structure to maximize air convection. This has been measured to lower the core temperature of transceivers by 5-8°C, which helps prevent thermal-induced performance drops and extends the operational life of the modules.

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