Superior High Density Press Fit SFP+ 2X8 Cage Connector Interconnect Solution S202H23000BA4

The S202H23000BA4 is a high-performance SFP+ 2X8 Cage Connector assembly engineered for the most demanding network environments. This integrated SFP+ 2X8 Cage Connector provides 16 high-speed ports in a stacked configuration, utilizing advanced EMI shielding and superior thermal management to ensure zero-packet-loss performance for 10G data transmissions.

Heat Sink	رقم
Cage Connector Type	SFP +
Light Pipe	رقم
Number of Ports	2*8
Terminal Tail	Press-Fit

S202H23000BA4

Product Overview

As a market-proven classic within Vitalconn’s interconnect family, this 2×8 stacked assembly is designed to empower AI computing, cloud-network convergence, and 5G infrastructure. It provides a stable 10Gbps per-channel rate, acting as an indispensable physical-layer foundation for enterprise core networks, storage systems, and high-performance computing (HPC) clusters.

Product Specifications

Part Number: S202H23000BA4.
Configuration: 2×8 Stacked (Ganged) ports for maximum density.
Interface Type: Integrated SFP+ Cage and Connector.
Data Rate: 10Gbps per channel.
Manufacturing Precision: High-precision engineering with general tolerances reaching .XXX±0.10.
Compatibility: Backward compatible with standard SFP modules to protect existing infrastructure investments.

Product Features

Superior EMI Shielding: Features multi-point beryllium copper grounding springs for 360-degree low-impedance connections and precision shielding fingers to block high-frequency radiation.
Advanced Thermal Management: The open-frame structure acts as a “dedicated air conditioner,” reducing transceiver operating core temperatures by 5-8°C through enhanced natural air convection.
Press-Fit High Reliability: Utilizes mechanical interlocking that offers a FIT (Failure In Time) value 10-30x lower than traditional SMT soldering, making it “fearless” in harsh environments.
Low Latency Transmission: Optimized internal structures strictly control electromagnetic crosstalk (<-40dB@10GHz) to support microsecond-level data exchange.

Applications

Data Centers: High-density ToR (Top-of-Rack) access and core-layer switch interconnects.
5G Communications: Stable physical-layer connections for base station AAU/DU units and Open RAN evolution.
AI Infrastructure: Massive data throughput for AI training clusters and real-time inference centers.
Enterprise Networks: Core network upgrades and storage networks requiring business continuity.

Packing Details

Components are packaged in blister trays. To ensure maximum component protection and shipping efficiency, adjacent blisters are placed at a 180-degree horizontal orientation relative to each other.

FAQ

Q1: What are the primary advantages of the 2×8 stacked port configuration? A: The 2×8 configuration provides a total of 16 ports in a single assembly, doubling the vertical port density compared to single-row designs. This allows equipment manufacturers to maximize bandwidth in limited rack space, which is critical for hyperscale cloud data centers.

Q2: How does the Press-Fit technology improve long-term reliability? A: Press-Fit technology uses a cold-press mechanical connection that fundamentally eliminates the risk of solder joint cracking caused by thermal stress or vibration. This results in a connection that is 10-30 times more reliable than traditional soldering, ensuring a stable lifecycle for mission-critical infrastructure.

Q3: Can this cage assembly help manage the heat generated by high-speed transceivers? A: Yes. The cage features an open-frame top-punch array that maximizes natural air convection. These features have been measured to reduce the core temperature of transceivers by 5-8°C, preventing performance throttling and extending component life.